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MCR03EZPFX1103 - ROHM Semiconductor

Description: RESISTOR, 0603 110 KOhm ±1% 0.1 W

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MCR03EZPFX1103 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX1103 Details

  • Manufacturer Part Number:

    MCR03EZPFX1103

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    110000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX1103 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the input voltage is within the recommended range, and that the device is properly decoupled with a 10uF capacitor. Also, ensure that the PCB is designed to minimize thermal gradients.
  • The maximum allowable power dissipation is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • Yes, the MCR03EZPFX1103 is qualified to the AEC-Q100 standard, which ensures its suitability for high-reliability applications such as automotive systems.
  • The MCR03EZPFX1103 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage.

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MCR03EZPFX1103 Overview

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Part Image CQ03SAF1103TDE Royal Electronic Factory (Thailand) Co Ltd

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Part Image RMGW16K1103FB Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 110000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

Part Image RMGW16K1103FTP Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 110000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

Part Image RC0603FRF13110KL YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 110000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603

Part Image 0603WGF1103B4 Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 110000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603

For a full list of alternate parts for MCR03EZPFX1103, check out Findchips.com