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MCR03EZPFX2000 - ROHM Semiconductor

Description: 0603 Thick Film Resistor 0.1W, 200R ROHM MCR Series Thick Film Surface Mount Resistor 0603 Case 200Ω ±1% 0.1W ±100ppm/°C

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MCR03EZPFX2000 - ROHM Semiconductor - PCB symbol
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MCR03EZPFX2000 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - MCR03
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MCR03EZPFX2000 - ROHM Semiconductor - 3D model - Resistor Chip - MCR03
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MCR03EZPFX2000 Details

  • Manufacturer Part Number:

    MCR03EZPFX2000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCR03EZPFX2000 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Handle the device by the body, not the leads. Avoid bending or twisting the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Yes, the MCR03EZPFX2000 is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, additional testing and validation may be required to meet specific industry standards.
  • Use a thermal imaging camera to identify hotspots. Check the PCB layout and thermal design for any issues. Verify that the device is operated within the recommended voltage and current ratings. Consult the datasheet and application notes for troubleshooting guidelines.

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MCR03EZPFX2000 Overview

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MCR03EZPFX2000 Alternates

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Part Image RK73H1JLBC2000F KOA Speer Electronics Inc

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Part Image 0603WGF2000BB Royal Electronic Factory (Thailand) Co Ltd

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