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MCSR04X1003FTL - Multicomp Pro

Description: MULTICOMP - MCSR04X1003FTL - RES, CERAMIC, 100K, 1%, 0.0625W, 0402

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PCB Footprints
MCSR04X1003FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCSR04
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MCSR04X1003FTL - Multicomp Pro  - 3D model - Resistor Chip - MCSR04
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MCSR04X1003FTL Details

  • Manufacturer Part Number:

    MCSR04X1003FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    13

  • Additional Feature:

    ANTI-SULFUR, LASER TRIMMABLE, RATED AC VOLTAGE (V): 50

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    100000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCSR04X1003FTL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MCSR04X1003FTL is to keep the component away from high-frequency signals, use a solid ground plane, and ensure good thermal conductivity. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The MCSR04X1003FTL has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if possible, and consider using thermal interface materials to improve heat transfer. The component's thermal pad should be connected to a solid ground plane for optimal heat dissipation.
  • The recommended soldering process for the MCSR04X1003FTL is to use a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. Hand soldering is not recommended due to the component's small size and high pin density.
  • To ensure the MCSR04X1003FTL's reliability in high-vibration environments, use a robust PCB design with a secure component mounting, and consider using underfill or potting compounds to reinforce the component's connections. Additionally, ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
  • The MCSR04X1003FTL is a sensitive electronic component and should be stored in a dry, cool place away from direct sunlight. Handle the component by the edges to prevent damage to the pins, and avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage.

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MCSR04X1003FTL Overview

Use the download button to access the MCSR04X1003FTL schematic symbol, PCB footprint, and 3D model.
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Part Image MC0402-1003-FBW RCD Components Inc

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Part Image 0402WGF1003C2E Royal Electronic Factory (Thailand) Co Ltd

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For a full list of alternate parts for MCSR04X1003FTL, check out Findchips.com