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MCU110N08Y-TP - MCC

Description: N-Channel 80 V 110A (Tc) 83W Surface Mount DPAK (TO-252)

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Symbol
MCU110N08Y-TP - MCC - PCB symbol
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PCB Footprints
MCU110N08Y-TP - MCC PCB footprint - Other - Other - MCU110N08Y-TP-3
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3D Models
MCU110N08Y-TP - MCC - 3D model - Other - MCU110N08Y-TP-3
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MCU110N08Y-TP Details

  • Manufacturer Part Number:

    MCU110N08Y-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    110 A

  • Drain-source On Resistance-Max:

    0.007 Ω

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    10

MCU110N08Y-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MCU110N08Y-TP is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, use a heat sink if necessary, and ensure good airflow around the device. The maximum junction temperature (Tj) should not exceed 150°C.
  • The maximum allowed voltage on the gate pin (Vgs) of the MCU110N08Y-TP is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation.
  • Yes, the MCU110N08Y-TP is suitable for high-frequency switching applications up to 100kHz. However, it's essential to consider the device's switching losses, gate charge, and layout parasitics to ensure reliable operation.
  • The MCU110N08Y-TP has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap, mat, or workstation to prevent damage to the device.

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MCU110N08Y-TP Overview

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