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MCWF08P4702FTL - Multicomp Pro

Description: RES, 47K, 1%, 0.25W, 0805, THICK FILM

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MCWF08P4702FTL - Multicomp Pro - PCB symbol
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PCB Footprints
MCWF08P4702FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCWF08P1201FTL-1
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3D Models
MCWF08P4702FTL - Multicomp Pro - 3D model - Resistor Chip - MCWF08P1201FTL-1
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MCWF08P4702FTL Details

  • Manufacturer Part Number:

    MCWF08P4702FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Additional Feature:

    LASER TRIMMABLE, HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    47000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

MCWF08P4702FTL Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MC08P4702FTL is a 1206 package with a pad size of 1.5mm x 0.75mm and a spacing of 0.5mm between pads. It's essential to follow the recommended footprint to ensure proper soldering and thermal management.
  • To handle thermal considerations, ensure a good thermal path from the component to a heat sink or a copper plane on the PCB. Use thermal vias and a thermal pad on the PCB to dissipate heat. Additionally, consider using a thermal interface material (TIM) between the component and the heat sink.
  • The maximum operating temperature range for the MC08P4702FTL is -55°C to +150°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
  • Yes, the MC08P4702FTL is designed to withstand high-vibration environments. However, it's essential to ensure the component is properly soldered and secured to the PCB to prevent mechanical stress and damage.
  • The recommended soldering profile for the MC08P4702FTL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is within the recommended profile to avoid damaging the component.

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MCWF08P4702FTL Overview

Use the download button to access the MCWF08P4702FTL schematic symbol, PCB footprint, and 3D model.
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MCWF08P4702FTL Alternates

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Part Image RK73H2ALTD4702F KOA Speer Electronics Inc

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Part Image FPS05FT-4702-MB Prosperity Dielectrics Co Ltd

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Part Image MR08X4702FGL Walsin Technology Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 47000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
For a full list of alternate parts for MCWF08P4702FTL, check out Findchips.com