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MCWR06X1004FTL - Multicomp Pro

Description: Res Thick Film 0603 1M Ohm 1% 0.1W(1/10W) ±100ppm/C Pad SMD T/R

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Symbol
MCWR06X1004FTL - Multicomp Pro - PCB symbol
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PCB Footprints
MCWR06X1004FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCWR06
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3D Models
MCWR06X1004FTL - Multicomp Pro - 3D model - Resistor Chip - MCWR06
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MCWR06X1004FTL Details

  • Manufacturer Part Number:

    MCWR06X1004FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    13

  • Additional Feature:

    LASER TRIMMABLE, RATED AC VOLTAGE (V): 75

  • Construction:

    Chip

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

MCWR06X1004FTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCWR06X1004FTL is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad on the PCB. The thermal resistance of the component is 35°C/W, and the maximum operating temperature is 150°C.
  • The recommended soldering process for the MCWR06X1004FTL is a reflow soldering process with a peak temperature of 260°C, and a dwell time of 20-30 seconds above 220°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material between the component and the PCB.
  • The MCWR06X1004FTL has an ESD sensitivity of 250V, meeting the Human Body Model (HBM) standard.

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MCWR06X1004FTL Overview

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