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MCWR12X3300FTL - Multicomp Pro

Description: RES, 330R, 1%, 0.25W, 1206, THICK FILM

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MCWR12X3300FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCWR12
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MCWR12X3300FTL - Multicomp Pro  - 3D model - Resistor Chip - MCWR12
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MCWR12X3300FTL Details

  • Manufacturer Part Number:

    MCWR12X3300FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Additional Feature:

    LASER TRIMMABLE, RATED AC VOLTAGE (V): 200

  • Construction:

    Chip

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

MCWR12X3300FTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCWR12X3300FTL is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. It's essential to follow the manufacturer's recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • The MCWR12X3300FTL has a high power rating, and proper thermal management is crucial. It's recommended to use a thermal pad or a heat sink to dissipate heat efficiently. The thermal pad should be connected to a copper plane or a heat sink with a thermal conductivity of at least 1 W/m-K. Additionally, ensure that the component is placed in a well-ventilated area to prevent overheating.
  • Although the datasheet specifies an operating temperature range of -40°C to +125°C, it's essential to note that the component's performance and reliability may degrade at extreme temperatures. It's recommended to operate the component within a temperature range of -20°C to +100°C for optimal performance and longevity.
  • The MCWR12X3300FTL is a ceramic-based component, which makes it susceptible to mechanical stress and vibration. While it can withstand some level of vibration, it's not recommended to use this component in high-vibration environments (e.g., aerospace, automotive, or industrial applications) without proper mechanical support and fixation. Consult with the manufacturer or a mechanical engineer to ensure the component's reliability in such environments.
  • To ensure the reliability and longevity of the MCWR12X3300FTL, follow proper storage and handling procedures, avoid exposing the component to moisture, and use a soldering process that meets the manufacturer's recommendations. Additionally, ensure that the component is operated within its specified ratings, and avoid over-stressing the component with excessive voltage, current, or temperature.

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MCWR12X3300FTL Overview

Use the download button to access the MCWR12X3300FTL schematic symbol, PCB footprint, and 3D model.
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Part Image RK73H2BTTDB3300F KOA Speer Electronics Inc

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For a full list of alternate parts for MCWR12X3300FTL, check out Findchips.com