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MCWR12X3301FTL - Multicomp Pro

Description: RES, 3K3, 1%, 0.25W, 1206, THICK FILM

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MCWR12X3301FTL - Multicomp Pro - PCB symbol
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PCB Footprints
MCWR12X3301FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MCWR12
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3D Models
MCWR12X3301FTL - Multicomp Pro - 3D model - Resistor Chip - MCWR12
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MCWR12X3301FTL Details

  • Manufacturer Part Number:

    MCWR12X3301FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Additional Feature:

    LASER TRIMMABLE, RATED AC VOLTAGE (V): 200

  • Construction:

    Chip

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    3300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

MCWR12X3301FTL Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCWR12X3301FTL is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • Yes, MCWR12X3301FTL is suitable for high-frequency applications up to 12 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the component's parasitic inductance and capacitance in your design.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, connected to a ground plane or a heat sink. This helps to dissipate heat generated by the component, especially in high-power applications.
  • Yes, MCWR12X3301FTL is compatible with lead-free soldering processes, such as SAC305 (Sn-Ag-Cu) or other RoHS-compliant solder alloys. However, it's essential to follow the recommended soldering profile and temperature guidelines to ensure reliable assembly.
  • The typical tolerance for the capacitance value of MCWR12X3301FTL is ±10%. This means that the actual capacitance value may vary by up to 10% from the nominal value of 33 pF.

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MCWR12X3301FTL Overview

Use the download button to access the MCWR12X3301FTL schematic symbol, PCB footprint, and 3D model.
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