MCZ33810EKR2 - NXP

MCZ33810EKR2 Details

• Manufacturer Part Number:

  MCZ33810EKR2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  1

• Built-in Protections:

  TRANSIENT; OVER CURRENT

• Driver Number of Bits:

  8

• Interface IC Type:

  BUFFER OR INVERTER BASED PERIPHERAL DRIVER

• JESD-30 Code:

  R-PDSO-G32

• JESD-609 Code:

  e3

• Length:

  11 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  32

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Current Flow Direction:

  SINK

• Output Current-Max:

  1 A

• Output Peak Current Limit-Nom:

  6 A

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HSSOP

• Package Equivalence Code:

  SSOP32,.4

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.45 mm

• Supply Voltage-Max:

  36 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  13 V

• Surface Mount:

  YES

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Turn-off Time:

  5 µs

• Turn-on Time:

  5 µs

• Width:

  7.5 mm