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MCZ33996EK - NXP

Description: NXP - MCZ33996EK - LOAD SWITCH, 16 O/P, 24 BIT SPI, 32WSOIC

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MCZ33996EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32LD SOIC W/B 98ARL10543D
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MCZ33996EK - NXP  - 3D model - Small Outline Packages - 32LD SOIC W/B 98ARL10543D
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MCZ33996EK Details

  • Manufacturer Part Number:

    MCZ33996EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    11 X 7.50 MM, 0.65 MM PITCH, LEAD FREE, SOIC-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    15

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    SIPO BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.008 A

  • Output Peak Current Limit-Nom:

    1.2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    27 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    10 µs

  • Width:

    7.5 mm

MCZ33996EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12273, which includes guidelines for component placement, routing, and thermal management.
  • The MCZ33996EK has a low-power mode that can be enabled by setting the PMIC_EN pin low and configuring the power modes using the I2C interface. Refer to the datasheet section 10.3 for more details.
  • The maximum current rating for the USB OTG port is 1.5A, as specified in the datasheet section 6.3.
  • The MCZ33996EK has a built-in thermal sensor that can be used to implement OTP. The thermal sensor output can be monitored using the I2C interface, and the system can be shut down or alerted when the temperature exceeds a certain threshold.
  • Yes, the MCZ33996EK is a standalone power management IC that can be used with any processor or system-on-chip (SoC). However, NXP provides optimized software drivers and support for their i.MX processors.

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MCZ33996EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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