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MD1211LG-G - Microchip

Description: Gate Drivers High Speed Dual

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MD1211LG-G - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC LG
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MD1211LG-G - Microchip  - 3D model - Small Outline Packages - 8 Lead SOIC LG
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MD1211LG-G Details

  • Manufacturer Part Number:

    MD1211LG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage1-Max:

    13 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.002 µs

  • Turn-on Time:

    0.002 µs

  • Width:

    3.9 mm

MD1211LG-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10uF capacitor between VCC and GND, and a 100nF capacitor between AVCC and AGND.
  • Use a common ground between devices, ensure signal lines are properly terminated, and use a baud rate that is within the device's specifications. Also, implement error-checking mechanisms, such as checksums or CRC, to detect data corruption.
  • The maximum cable length depends on the baud rate and the type of cable used. As a general rule, keep the cable length below 10 meters for baud rates above 9600bps. For lower baud rates, longer cable lengths may be possible.
  • Use an external power-on reset circuit, such as a voltage supervisor, to ensure a clean power-up sequence. For brown-out detection, use an external brown-out detector or implement a software-based detection mechanism that monitors the supply voltage.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the underside of the package. Keep the device's junction temperature below 150°C to ensure reliable operation.

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MD1211LG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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