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MD1810K6-G - Microchip

Description: Driver 2A 4-OUT Hi/Lo Side Non-Inv 16-Pin QFN EP T/R

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Symbol
MD1810K6-G - Microchip - PCB symbol
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PCB Footprints
MD1810K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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3D Models
MD1810K6-G - Microchip - 3D model - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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MD1810K6-G Details

  • Manufacturer Part Number:

    MD1810K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    13 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.001 µs

  • Turn-on Time:

    0.001 µs

  • Width:

    4 mm

MD1810K6-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB has adequate thermal vias and a sufficient copper area to dissipate heat.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Also, consider using a heat sink or thermal interface material to improve heat dissipation. Additionally, ensure that the PCB is designed to minimize thermal resistance.
  • The recommended soldering conditions for the MD1810K6-G are: peak temperature of 260°C, soldering time of 10-15 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C to 220°C.
  • To troubleshoot issues with the MD1810K6-G, start by verifying the power supply voltage and ensuring that it is within the recommended range. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to verify the output voltage and current. If issues persist, consult the datasheet and application notes for further guidance.
  • To ensure ESD protection for the MD1810K6-G, it is recommended to handle the device by the body or use an ESD wrist strap. Use an ESD-safe workstation and ensure that all tools and equipment are ESD-safe. Avoid touching the device pins or exposed internal circuitry.

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MD1810K6-G Overview

Use the download button to access the MD1810K6-G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MD181, or try a keyword search, such as MOSFET Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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