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MD1813K6-G - Microchip

Description: 4 QFN-16-EP(4x4) Gate Drivers ROHS

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PCB Footprints
MD1813K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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3D Models
MD1813K6-G - Microchip  - 3D model - Quad Flat No-Lead - 16-Lead QFN Package outline (K6)
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MD1813K6-G Details

  • Manufacturer Part Number:

    MD1813K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    AND GATE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    13 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    13 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.007 µs

  • Turn-on Time:

    0.007 µs

  • Width:

    4 mm

MD1813K6-G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Ensure the device is operated within the recommended temperature range and consider derating the device for high-temperature applications.
  • A reflow soldering profile with a peak temperature of 240°C to 250°C and a dwell time of 20-30 seconds is recommended. Ensure the device is soldered in a nitrogen atmosphere to prevent oxidation.
  • Verify the input voltage, output voltage, and feedback resistors are correctly configured. Check for any signs of overheating, and ensure the device is properly soldered and connected. Consult the datasheet and application notes for troubleshooting guidelines.
  • Implement proper PCB layout and shielding techniques to minimize EMI and RFI. Use a shielded enclosure, and consider adding EMI filters or ferrite beads to the input and output lines. Ensure the device is operated within the recommended frequency range.

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MD1813K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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