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MDB10S - onsemi

Description: Diode Rectifier Bridge Single 1KV 1A 4-Pin Micro DIP SMD T/R

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MDB10S - onsemi - PCB symbol
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PCB Footprints
MDB10S - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP4 5.0x4.4
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MDB10S - onsemi - 3D model - Small Outline Packages - TSSOP4 5.0x4.4
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MDB10S Details

  • Manufacturer Part Number:

    MDB10S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-4

  • Package Description:

    MICRODIP-4

  • Manufacturer Package Code:

    948BS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MDB10S Frequently Asked Questions (FAQs)

  • A good PCB layout for the MDB10S involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The input voltage (VIN) should be within the recommended range (2.7V to 5.5V). Additionally, ensure that the input voltage is stable and free of noise.
  • The MDB10S can handle a maximum current of 100mA. However, it's recommended to keep the current below 50mA to ensure reliable operation and to prevent overheating.
  • To protect the MDB10S from ESD and overvoltage, use a TVS (Transient Voltage Suppressor) diode or a Zener diode on the input lines. Additionally, use a series resistor to limit the input current and prevent damage from overvoltage.
  • The recommended operating temperature range for the MDB10S is -40°C to 125°C. However, the device can operate up to 150°C for short periods of time. It's essential to ensure proper thermal management to prevent overheating.

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MDB10S Overview

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