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MDF2016BSS180CTD25 - TDK

Description: 18 Ohms @ 2MHz 1 Power Line Ferrite Bead 0806 (2016 Metric) 1.1A 200mOhm

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PCB Footprints
MDF2016BSS180CTD25 - TDK PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MDF2016-1
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3D Models
MDF2016BSS180CTD25 - TDK  - 3D model - Ferrite Bead Chip - MDF2016-1
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MDF2016BSS180CTD25 Details

  • Manufacturer Part Number:

    MDF2016BSS180CTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.69

  • DC Resistance-Max:

    0.2 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    1 mm

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    18 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • Rated Current:

    1.1 A

  • Screening Level:

    AEC-Q200

  • Width:

    1.6 mm

MDF2016BSS180CTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MDF2016BSS180CTD25 is a rectangular pad with a size of 1.6mm x 0.8mm, with a solder mask opening of 1.2mm x 0.4mm. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal stress.
  • While MDF2016BSS180CTD25 has a rated operating temperature range of -55°C to 125°C, it's not recommended for high-temperature applications above 105°C. Prolonged exposure to high temperatures can affect the component's reliability and lifespan. If you need a high-temperature solution, consider using a different component or consulting with TDK Corporation's application engineers.
  • To prevent damage during assembly, handle MDF2016BSS180CTD25 by the edges or the body, avoiding touching the terminals or the ceramic surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the component, as it can cause mechanical stress and affect its performance.
  • The recommended soldering profile for MDF2016BSS180CTD25 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. It's essential to follow the recommended soldering profile to ensure reliable solder joints and to prevent thermal damage to the component.
  • MDF2016BSS180CTD25 is designed to withstand moderate vibration and shock. However, if your application requires extreme vibration or shock resistance, you may need to consider additional mechanical support or a different component. Consult with TDK Corporation's application engineers or perform thorough testing to ensure the component's reliability in your specific application.

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MDF2016BSS180CTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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