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MDS5652URH - MagnaChip

Description: MagnaChip MDS5652URH Dual N-channel MOSFET Transistor, 7.5 A, 30 V, 8-Pin SOIC

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PCB Footprints
MDS5652URH - MagnaChip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Leads, SOIC)_2021
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3D Models
MDS5652URH - MagnaChip  - 3D model - Small Outline Packages - 8 Leads, SOIC)_2021
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MDS5652URH Details

  • Manufacturer Part Number:

    MDS5652URH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    MagnaChip Semiconductor Ltd

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    12 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7.5 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    58 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MDS5652URH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to monitor temperature.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the MDS5652URH is suitable for high-reliability and automotive applications. However, additional testing and qualification may be required to meet specific industry standards, such as AEC-Q100 or IATF 16949.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, decoupling capacitors, and PCB layout for any issues. Consult the datasheet and application notes for troubleshooting guidelines.

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MDS5652URH Overview

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