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MEC1416-NU - Microchip

Description: 32-bit Microcontrollers - MCU MEC MIPS core 160K PC & eSPI, 128-VTQFP

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MEC1416-NU - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - VTQFP 128
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MEC1416-NU - Microchip  - 3D model - Quad Flat Packages - VTQFP 128
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MEC1416-NU Details

  • Manufacturer Part Number:

    MEC1416-NU

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    14 X 14 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, MS-026, VTQFP-128

  • Pin Count:

    128

  • Manufacturer Package Code:

    TQFP-128

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • JESD-30 Code:

    S-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    128

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

MEC1416-NU Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current specifications.
  • Use a metal shield or a conductive enclosure to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). Ensure that the PCB layout is designed to minimize radiation and susceptibility to external interference.
  • Follow the recommended power-up and power-down sequences to prevent damage to the device. Ensure that the voltage supply ramps up and down slowly (typically 10-20 ms) to prevent inrush currents and voltage spikes.
  • Follow the recommended PCB assembly and rework guidelines to prevent damage to the device. Use a reflow oven or a hot air rework station with a temperature-controlled profile to prevent overheating or thermal shock.

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MEC1416-NU Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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