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MEC1521H-B0-I/SZ-TR - Microchip

Description: ARM Microcontrollers - MCU Embedded Controller, 256KB SRAM 3.3 V and 1.8 V Voltage - Supply 1.71V ~ 3.465V Operating Temperature -40°C ~ 85°C (TA)

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MEC1521H-B0-I/SZ-TR - Microchip - PCB symbol
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PCB Footprints
MEC1521H-B0-I/SZ-TR - Microchip PCB footprint - BGA - BGA - 144 Pin WFBGA/SZ
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MEC1521H-B0-I/SZ-TR - Microchip - 3D model - BGA - 144 Pin WFBGA/SZ
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MEC1521H-B0-I/SZ-TR Details

  • Manufacturer Part Number:

    MEC1521H-B0-I/SZ-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WFBGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    WFBGA-144

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Additional Feature:

    ALSO OPERATES AT 3.3V NOMINAL VOLATGE

  • Bus Compatibility:

    I2C, ESPI, UART

  • Clock Frequency-Max:

    0.032768 MHz

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    9 mm

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA144,13X13,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

MEC1521H-B0-I/SZ-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane on the bottom layer, and thermal vias connecting the top layer to the ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients and hotspots. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • Operating the device at the maximum junction temperature (TJ) can reduce its lifespan and reliability. It's recommended to operate the device at a lower TJ to ensure optimal performance and longevity.
  • Check the power supply voltage, ensure that the POR pin is properly connected, and verify that the reset signal is properly generated. Also, review the device's datasheet and application notes for specific troubleshooting guidelines.
  • Follow proper PCB design and layout guidelines to minimize EMI, use shielding and filtering as necessary, and ensure that the device is operated within the recommended frequency range to minimize EMC issues.

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MEC1521H-B0-I/SZ-TR Overview

Use the download button to access the MEC1521H-B0-I/SZ-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MEC15, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MEC1521H-B0-I/SZ Microchip Technology Inc

Microprocessor Circuit, CMOS, PBGA144