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MEC1703Q-C2-TN - Microchip

Description: I/O Controller Interface IC Embedded controller 480 KB Total SRAM

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PCB Footprints
MEC1703Q-C2-TN - Microchip PCB footprint - BGA - BGA - 169-WFBGA-11-11B-0.8P_2024
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3D Models
MEC1703Q-C2-TN - Microchip  - 3D model - BGA - 169-WFBGA-11-11B-0.8P_2024
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MEC1703Q-C2-TN Details

  • Manufacturer Part Number:

    MEC1703Q-C2-TN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WFBGA-169

  • Pin Count:

    169

  • Manufacturer Package Code:

    WFBGA-169

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Additional Feature:

    ALSO OPERATES AT 3.3V NOMINAL

  • JESD-30 Code:

    S-PBGA-B169

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Number of Terminals:

    169

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

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MEC1703Q-C2-TN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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