MEM2012S35R0T001 footprint, schematic symbol and 3D model by TDK

Symbol

click to zoom

PCB Footprints

MEM2012S35R0T001 - TDK PCB footprint - Other - Other - MEM2012S35R0T001

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for MEM2012S35R0T001
Part Number MEM2012S35R0T001
Manufacturer TDK
Pin Count 3
Part Category Filter
Package Category Other
Footprint Name Other - MEM2012S35R0T001
Released Date Oct 21, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

MEM2012S35R0T001 Details

Manufacturer Part Number:
MEM2012S35R0T001
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT, EIA STD PACKAGE SIZE 2012, SMD, 4 PIN
ECCN Code:
EAR99
HTS Code:
8504.50.80.00
Factory Lead Time:
15 Weeks
Manufacturer:
TDK Corporation
YTEOL:
7.19
Additional Feature:
T-TYPE CIRCUIT
Filter Type:
DATA LINE FILTER
Height:
0.85 mm
Insertion Loss-Max:
30 dB
Length:
2 mm
Mounting Type:
SURFACE MOUNT
Number of Functions:
1
Number of Terminals:
4
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Packing Method:
TAPE AND REEL
Rated Current:
0.1 A
Rated Voltage:
10 V
Width:
1.25 mm

MEM2012S35R0T001 Frequently Asked Questions (FAQs)

The recommended land pattern for MEM2012S35R0T001 is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.8mm x 0.5mm. The land pattern should be designed to accommodate the component's termination style, which is a bottom electrode with a solderable metalization.
The MEM2012S35R0T001 is a moisture-sensitive device and requires special handling. It should be stored in a dry environment with a relative humidity of 20% or less. When handling the component, it's essential to wear an anti-static wrist strap and avoid touching the component's leads or body. Baking the component at 125°C for 24 hours can help to remove any moisture that may have been absorbed during storage.
The maximum reflow temperature for MEM2012S35R0T001 is 260°C. It's essential to follow the recommended reflow profile to avoid damaging the component. The reflow process should be done in a nitrogen atmosphere to prevent oxidation.
The MEM2012S35R0T001 is designed to withstand moderate vibration levels. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent movement during vibration. It's recommended to perform vibration testing to ensure the component's reliability in the specific application.
To troubleshoot issues with the MEM2012S35R0T001, start by verifying the component's polarity and ensuring that it's properly soldered to the PCB. Check the component's voltage rating and ensure that it's not exceeding the maximum specified voltage. Use a multimeter to measure the component's capacitance and ESR to identify any anomalies. If the issue persists, consult the datasheet and application notes or contact TDK Corporation's technical support for further assistance.

Trust Checks

Manufacturer Collaborated

System Verified

Community Approved

MEM2012S35R0T001 Overview

Use the download button to access the MEM2012S35R0T001 schematic symbol and PCB footprint.

To find more CAD model downloads similar to this part, try a partial part number search, like MEM20, or try a keyword search, such as Data Line Filters

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

Parts related to MEM2012S35R0T001

Showing 0 results