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MGC3030-I/SS - Microchip

Description: Tracking and Gesture Controller

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MGC3030-I/SS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (SS)28-Lead(SSOP)
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MGC3030-I/SS - Microchip  - 3D model - Small Outline Packages - (SS)28-Lead(SSOP)
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MGC3030-I/SS Details

  • Manufacturer Part Number:

    MGC3030-I/SS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SSOP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5.3 mm

MGC3030-I/SS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency traces short and away from the edges of the board. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency is within the recommended range. Implement error checking and correction mechanisms, such as CRC or checksum, to detect and correct data transmission errors.
  • The MGC3030-I/SS is rated for operation from -40°C to +85°C. However, the device may not perform optimally at the extreme ends of this range. Ensure that the device is operated within the recommended temperature range for optimal performance.
  • Follow the calibration procedure outlined in the datasheet, which involves setting the internal registers to the recommended values. Perform a self-test to verify that the device is functioning correctly. Repeat the calibration process after any changes to the device or the system.
  • The MGC3030-I/SS has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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MGC3030-I/SS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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