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MGD3160AM315EK - NXP

Description: Gate Drivers EV Inverter Control; IGBT & SiC GDIC

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MGD3160AM315EK - NXP - PCB symbol
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MGD3160AM315EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - MGD3160AM315EK-
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MGD3160AM315EK - NXP - 3D model - Small Outline Packages - MGD3160AM315EK-
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MGD3160AM315EK Details

  • Manufacturer Part Number:

    MGD3160AM315EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-on Time:

    0.15 µs

  • Width:

    7.5 mm

MGD3160AM315EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MGD3160AM315EK application note (AN11535). It's essential to follow these guidelines to ensure optimal performance, thermal stability, and to prevent overheating.
  • The MGD3160AM315EK has multiple configuration options for optimizing efficiency and power consumption. Refer to the device's application note (AN11535) and the NXP Power Management Guide for detailed information on configuring the device for specific use cases.
  • NXP recommends using X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for the input and output capacitors. The recommended capacitance values are 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor.
  • NXP provides a troubleshooting guide in the MGD3160AM315EK application note (AN11535) that covers common issues and their solutions. Additionally, the NXP support team and online forums can provide further assistance.
  • The thermal resistance (RθJA) of the MGD3160AM315EK is 25°C/W, and the junction temperature rating is 150°C. It's essential to ensure that the device operates within these thermal limits to prevent overheating and damage.

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MGD3160AM315EK Overview

Use the download button to access the MGD3160AM315EK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MGD31, or try a keyword search, such as MOSFET Drivers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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