MGS15243R3 - Cosel

MGS15243R3 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Cosel recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2oz copper thickness. A thermal via array under the module can also improve heat transfer.
• How do I ensure reliable start-up and shutdown of the MGS15243R3?
  To ensure reliable start-up and shutdown, Cosel recommends a soft-start circuit to limit inrush current, and a shutdown circuit with a minimum 10ms delay to prevent voltage spikes.
• What are the derating curves for the MGS15243R3 at high ambient temperatures?
  Cosel provides derating curves in the application note AN-101, which shows the maximum output power vs. ambient temperature. Engineers can use these curves to determine the maximum output power at their specific operating temperature.
• Can I use the MGS15243R3 in a redundant configuration for high availability applications?
  Yes, the MGS15243R3 can be used in a redundant configuration. Cosel recommends using a diode ORing circuit to connect multiple modules in parallel, ensuring that the output voltage is maintained even if one module fails.
• What are the EMI filter requirements for the MGS15243R3?
  Cosel recommends using a CISPR 22 Class B compliant EMI filter at the input of the MGS15243R3 to ensure electromagnetic compatibility. The filter should be designed to attenuate conducted emissions in the frequency range of 150 kHz to 30 MHz.