Laird recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1W/m-K or higher is suggested for optimal thermal management.
Laird recommends following the JEDEC J-STD-020D.1 standard for reflow soldering, with a peak temperature of 260°C and a dwell time of 20-30 seconds. Additionally, a nitrogen atmosphere is recommended to reduce oxidation.
The MGV10042R2M-10 is rated for operation from -40°C to 85°C, but derating is required for temperatures above 70°C. Consult the datasheet for specific derating curves.
Laird recommends following the ESD Association standard ANSI/ESD S20.20 for ESD protection. This includes using ESD-safe materials, grounding personnel, and using ESD-protective packaging.
Laird recommends storing the component in its original packaging, away from direct sunlight and moisture. The component should be handled in a clean, dry environment, and should not be exposed to mechanical stress or vibration.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MGV10042R2M-10 Overview
Use the download button to access the MGV10042R2M-10 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MGV10,
or try a keyword search, such as Fixed Inductors
