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MH1005-471Y - Bourns

Description: FB,1x0.5x0.5mm,470 Ohm±25%@100MHz,1.1A

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PCB Footprints
MH1005-471Y - Bourns PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MH1005-471Y
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3D Models
MH1005-471Y - Bourns  - 3D model - Ferrite Bead Chip - MH1005-471Y
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MH1005-471Y Details

  • Manufacturer Part Number:

    MH1005-471Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.19

  • DC Resistance-Max:

    0.18 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    0.5 mm

  • Length:

    1 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    470 OHM Ω

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Current:

    1.1 A

  • Width:

    0.5 mm

MH1005-471Y Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow this layout to ensure proper thermal management and to prevent electrical noise.
  • To handle the high current rating, ensure that the PCB traces are wide enough to handle the current density. A general rule of thumb is to use a trace width of at least 1 oz (35 μm) for every 1 A of current. Additionally, consider using multiple vias to connect the component to the PCB's power plane.
  • The thermal resistance of the MH1005-471Y is not explicitly stated in the datasheet. However, Bourns provides a thermal model in their application note AN164, which can be used to estimate the thermal resistance. This information is crucial for designing an effective thermal management system to prevent overheating.
  • While the MH1005-471Y is a robust component, it's essential to consider the vibration environment in your design. Bourns recommends following the guidelines in their application note AN164 for designing a vibration-resistant PCB. Additionally, consider using a vibration-dampening material or a conformal coating to reduce the risk of component failure.
  • To ensure EMC, follow the guidelines in Bourns' application note AN164 for designing a shielded PCB. Additionally, consider using a common-mode choke or a ferrite bead to reduce electromagnetic interference (EMI). It's also essential to keep the MH1005-471Y away from sensitive components and to use a ground plane to reduce radiation.

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MH1005-471Y Overview

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