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MH11063-H1 - Foxconn

Description: MH Series Single, R/A, T/H Type 6 Position 250V , 2A , -55℃ to +105℃

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PCB Footprints
MH11063-H1 - Foxconn PCB footprint - Other - Other - MH11063-H1-3
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3D Models
MH11063-H1 - Foxconn  - 3D model - Other - MH11063-H1-3
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MH11063-H1 Details

  • Manufacturer Part Number:

    MH11063-H1

  • Part Life Cycle Code:

    Obsolete

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.20

  • Manufacturer:

    Foxconn Interconnect Technology Limited

  • YTEOL:

    0

  • Board Mounting Option:

    SPLIT BOARD LOCK

  • Body Breadth:

    0.512 inch

  • Body Depth:

    0.504 inch

  • Body Length:

    0.551 inch

  • Body/Shell Style:

    RECEPTACLE

  • Connector Type:

    MINI DIN CONNECTOR

  • Contact Finish Mating:

    AU

  • Contact Gender:

    FEMALE

  • Contact Material:

    COPPER ALLOY

  • Contact Resistance:

    30 mΩ

  • Contact Style:

    RND PIN-SKT

  • DIN Conformance:

    NO

  • Dielectric Withstanding Voltage:

    750VAC V

  • Durability:

    500 Cycles

  • EMI Shielded:

    NO

  • IEC Conformance:

    NO

  • Insertion Force-Max:

    44.48 N

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    POLYETHYLENE

  • MIL Conformance:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number of Ports:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Option:

    GENERAL PURPOSE

  • Plating Thickness:

    30u inch

  • Polarization Key:

    POLARIZED

  • Rated Current (Signal):

    2 A

  • Reference Standard:

    UL

  • Shell Material:

    COPPER ALLOY

  • Terminal Length:

    0.125 inch

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    6

  • Withdrawl Force-Min:

    8.896 N

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MH11063-H1 Overview

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