The recommended land pattern for the MI0603J680R-10 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
Yes, the MI0603J680R-10 is suitable for high-frequency applications up to 6 GHz, but it's recommended to consult with Laird's application engineers for specific design guidance.
The thermal resistance of the MI0603J680R-10 is approximately 20°C/W, but this value can vary depending on the specific application and PCB design.
Yes, the MI0603J680R-10 is compatible with lead-free soldering processes, and it meets the requirements of the RoHS directive.
The maximum operating temperature of the MI0603J680R-10 is 125°C, but it's recommended to derate the component's power handling at higher temperatures.
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MI0603J680R-10 Overview
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