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MI0805L301R-10 - Laird Technologies

Description: Laird Technologies Ferrite Bead (Chip Bead), 2 x 1.25 x 0.9mm (0805 (2012M)), 135Ω impedance at 25 MHz, 300Ω impedance

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MI0805L301R-10 - Laird Technologies PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - 0805 (1.1 thickness)
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3D Models
MI0805L301R-10 - Laird Technologies  - 3D model - Ferrite Bead Chip - 0805 (1.1 thickness)
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MI0805L301R-10 Details

  • Manufacturer Part Number:

    MI0805L301R-10

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, EIA STD PACKAGE SIZE 0805, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Qnity Laird

  • YTEOL:

    6.79

  • Case Code:

    0805

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.06 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    1000 MHz

  • Frequency-Min:

    25 MHz

  • Height:

    0.9 mm

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    300 OHM Ω

  • Packing Method:

    TR

  • Rated Current:

    2 A

  • Terminal Finish:

    Tin (Sn)

  • Width:

    1.25 mm

MI0805L301R-10 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MI0805L301R-10 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, the MI0805L301R-10 is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the maximum operating temperature may vary depending on the specific use case and environmental conditions.
  • Yes, the MI0805L301R-10 is compatible with lead-free soldering processes and is RoHS compliant.
  • The typical impedance of the MI0805L301R-10 at high frequencies (e.g. 1 GHz) is around 50 ohms, but this may vary depending on the specific application and PCB layout.
  • The MI0805L301R-10 is rated for a maximum power dissipation of 0.5 W, making it suitable for low-to-moderate power applications. For high-power applications, a different component may be required.

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MI0805L301R-10 Overview

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