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MI1206L501R-10 - Laird Technologies

Description: Ferrite Beads 500ohms 100MHz 2A Monolithic 1206 SMD

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MI1206L501R-10 - Laird Technologies - PCB symbol
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PCB Footprints
MI1206L501R-10 - Laird Technologies PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MI1206K900R-10
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3D Models
MI1206L501R-10 - Laird Technologies - 3D model - Ferrite Bead Chip - MI1206K900R-10
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MI1206L501R-10 Details

  • Manufacturer Part Number:

    MI1206L501R-10

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, EIA STD PACKAGE SIZE 1206, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Qnity Laird

  • YTEOL:

    6.59

  • Case Code:

    1206

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.06 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    1000 MHz

  • Frequency-Min:

    25 MHz

  • Height:

    1.1 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    500 OHM Ω

  • Packing Method:

    TR

  • Rated Current:

    2 A

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Width:

    1.6 mm

MI1206L501R-10 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MI1206L501R-10 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • The MI1206L501R-10 has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal interface material, and provide adequate airflow around the component.
  • The maximum operating temperature range for the MI1206L501R-10 is -40°C to +125°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or potting compound to reduce stress on the component.
  • The recommended storage condition for the MI1206L501R-10 is in a dry, cool place, away from direct sunlight, with a temperature range of 20°C to 30°C and humidity below 60%.

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MI1206L501R-10 Overview

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