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MIC2103YML-TR - Microchip

Description: Switching Controllers 75V DC-DC Buck Controller with HLL

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PCB Footprints
MIC2103YML-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MIC2103YML-TR
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3D Models
MIC2103YML-TR - Microchip  - 3D model - Quad Flat No-Lead - MIC2103YML-TR
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MIC2103YML-TR Details

  • Manufacturer Part Number:

    MIC2103YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Input Voltage-Max:

    75 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    15 A

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    750 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MIC2103YML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2103YML-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have a solid ground plane to help dissipate heat.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design guidelines, such as using a heat sink, ensuring good airflow, and keeping the device within its specified operating temperature range.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and even permanent damage to the device. It's crucial to ensure the device operates within its specified temperature range.
  • Yes, the MIC2103YML-TR is designed to operate in high-vibration environments. However, it's essential to ensure the device is properly secured to the PCB and that the PCB is designed to withstand the vibrations.
  • To troubleshoot issues with the MIC2103YML-TR, start by checking the power supply, input voltage, and output voltage. Verify that the device is properly connected and configured. If issues persist, consult the datasheet and application notes or contact Microchip's technical support.

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MIC2103YML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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