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MIC2172YM-TR - Microchip

Description: Switching Voltage Regulators 1.25A 100kHz Switching Regulator

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MIC2172YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-SOIC ---
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MIC2172YM-TR - Microchip  - 3D model - Small Outline Packages - 8-SOIC ---
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MIC2172YM-TR Details

  • Manufacturer Part Number:

    MIC2172YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    115 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

MIC2172YM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2172YM-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or use thermal simulation tools to optimize the design.
  • To ensure reliable start-up and shutdown, it's crucial to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, ensure that the input voltage rises and falls monotonically, and that the input capacitance is sufficient to filter out noise and ripple.
  • Operating the MIC2172YM-TR at high ambient temperatures can reduce its reliability and lifespan. It's essential to derate the device's power dissipation and ensure good airflow to prevent overheating. Consult the datasheet for thermal derating curves and guidelines for high-temperature operation.
  • To troubleshoot issues with the MIC2172YM-TR, start by verifying the input voltage, output voltage, and current. Check for signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to inspect the output voltage and current waveforms, and consult the datasheet for troubleshooting guidelines.
  • Yes, the MIC2172YM-TR can be used in a redundant or parallel configuration to achieve higher power or reliability. However, it's essential to follow proper design guidelines and ensure that the devices are properly synchronized and matched to prevent oscillations or instability.

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MIC2172YM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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