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MIC2179YSM - Microchip

Description: Microchip, MIC2179YSM Switching Regulator, 1-Channel 1.5A Adjustable 20-Pin, SSOP

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MIC2179YSM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 20 pin ssop
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MIC2179YSM - Microchip  - 3D model - Small Outline Packages - 20 pin ssop
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MIC2179YSM Details

  • Manufacturer Part Number:

    MIC2179YSM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SSOP-20

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    3.46 V

  • Output Voltage-Min:

    3.14 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    240 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

MIC2179YSM Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid copper plane underneath the MIC2179YSM, and to use thermal vias to connect the plane to the top layer. Additionally, keeping the PCB layers as thin as possible and using a high-thermal-conductivity PCB material can also help to improve thermal performance.
  • To ensure reliable start-up of the MIC2179YSM, it is recommended to use a soft-start circuit to limit the inrush current during power-up. Additionally, ensuring that the input voltage rises slowly and monotonically, and using a high-quality input capacitor with low ESR can also help to improve start-up reliability.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage can cause damage to the device. It is recommended to use a voltage divider or a clamp circuit to limit the voltage on the EN pin to within the recommended range.
  • The output voltage ripple of the MIC2179YSM can be calculated using the following formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. The output voltage ripple can also be measured using an oscilloscope.
  • The recommended input capacitor type for the MIC2179YSM is a low-ESR ceramic capacitor, such as an X5R or X7R type. The recommended value is 10uF to 22uF, depending on the input voltage and output current requirements. A higher value capacitor can help to improve input voltage ripple rejection and reduce noise.

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MIC2179YSM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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