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MIC2298-15YML-TR - Microchip

Description: 3.5A MINIMUM, 1MHZ BOOST HIGH BRIGHTNESS WHITE LED DRIVER

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PCB Footprints
MIC2298-15YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-PIN 3MMX3MM MLF
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3D Models
MIC2298-15YML-TR - Microchip  - 3D model - Small Outline No-lead - 12-PIN 3MMX3MM MLF
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MIC2298-15YML-TR Details

  • Manufacturer Part Number:

    MIC2298-15YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    12

  • Manufacturer Package Code:

    VDFN-12

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    10 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

MIC2298-15YML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2298-15YML-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note or a reference design from Microchip can provide more specific guidance.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a low melting point and a flux that is compatible with the device's package. It's also important to handle the device by the body and not the leads to prevent damage.
  • Operating the MIC2298-15YML-TR beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to adhere to the recommended operating conditions specified in the datasheet to ensure the device operates within its design specifications.
  • To troubleshoot issues with the MIC2298-15YML-TR, start by reviewing the datasheet and application notes to ensure proper usage and configuration. Then, use a systematic approach to isolate the problem, checking for issues such as incorrect pin connections, inadequate power supply, or thermal issues. If the problem persists, contact Microchip's technical support for further assistance.
  • Yes, the MIC2298-15YML-TR is a high-frequency device, and as such, it requires careful consideration of EMI/EMC issues. Ensure proper PCB layout, use of shielding, and filtering to minimize electromagnetic interference. Additionally, follow the guidelines provided in the datasheet and relevant application notes to ensure compliance with EMI/EMC regulations.

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MIC2298-15YML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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