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MIC23050-GYML-TR - Microchip

Description: Switching Voltage Regulators High Efficiency 600mA Buck Switcher

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PCB Footprints
MIC23050-GYML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-PIN 2MMX2MM MLF
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3D Models
MIC23050-GYML-TR - Microchip  - 3D model - Small Outline No-lead - 8-PIN 2MMX2MM MLF
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MIC23050-GYML-TR Details

  • Manufacturer Part Number:

    MIC23050-GYML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4600 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

MIC23050-GYML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC23050-GYML-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Microchip provides additional recommendations.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequencing, as outlined in the datasheet. Additionally, ensure that the input voltage is stable and within the recommended range, and that the output capacitors are properly sized.
  • To ensure EMI and EMC compliance, follow proper PCB layout and routing guidelines, use shielding and filtering as needed, and ensure that the device is properly decoupled. Additionally, consider using a common-mode choke and a ferrite bead to reduce EMI emissions.
  • To troubleshoot issues with the MIC23050-GYML-TR, start by verifying the input voltage and current, and checking for any signs of overheating. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. Consult the datasheet and application notes for additional troubleshooting guidance.
  • Operating the MIC23050-GYML-TR at high temperatures can reduce its reliability and lifespan. Ensure that the device is properly heat-sunk and that the ambient temperature is within the recommended range. Consult the datasheet for thermal derating guidelines and consider using a thermal monitoring and protection circuit.

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MIC23050-GYML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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