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MIC23201YML-TR - Microchip

Description: Conv DC-DC 2.7V to 5.5V Step Down Single-Out 0.95V to 36V 2A 10-Pin DFN EP T/R

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PCB Footprints
MIC23201YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 11 DFN-+-
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MIC23201YML-TR - Microchip  - 3D model - Small Outline No-lead - 11 DFN-+-
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MIC23201YML-TR Details

  • Manufacturer Part Number:

    MIC23201YML-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, LCC10,.12,20

  • Pin Count:

    10

  • Manufacturer Package Code:

    VDFN-10

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    3.6 V

  • Output Voltage-Min:

    0.95 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    LCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MIC23201YML-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a reference design would be helpful.
  • In addition to following the recommended operating conditions, ensure good thermal design, and consider using thermal protection features like over-temperature shutdown. Also, verify the device's performance at the highest expected temperature.
  • Use a common-mode choke, ferrite beads, and capacitors to filter out high-frequency noise. Shielding can be achieved with a metal can or a shielded enclosure. Follow proper PCB layout and grounding techniques to minimize EMI.
  • Use a systematic approach: check the power supply, verify the input voltage, and monitor the output voltage. Use an oscilloscope to check for noise or oscillations. Consult the datasheet and application notes for troubleshooting guides.
  • Ensure the device is used within its recommended operating conditions and follow proper design and testing procedures. Consider using redundant systems, error detection, and correction mechanisms to ensure reliability and safety.

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MIC23201YML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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