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MIC23303YML-TR - Microchip

Description: Conv DC-DC 2.7V to 5.5V Synchronous Step Down Single-Out 0.65V to 3.6V 3A 12-Pin DFN EP T/R

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MIC23303YML-TR - Microchip - PCB symbol
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PCB Footprints
MIC23303YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-PIN 3MMX3MM MLF
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3D Models
MIC23303YML-TR - Microchip - 3D model - Small Outline No-lead - 12-PIN 3MMX3MM MLF
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MIC23303YML-TR Details

  • Manufacturer Part Number:

    MIC23303YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    VDFN-12

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    3.6 V

  • Output Voltage-Min:

    0.65 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MIC23303YML-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • Microchip provides a configuration tool or a software development kit (SDK) that can help with configuration. Additionally, the datasheet and application notes provide guidance on setting the correct registers and configuration bits.
  • Common failure modes include overheating, overvoltage, and electrical overstress. To mitigate these, ensure proper thermal design, use voltage protection circuits, and follow proper handling and storage procedures.
  • Use a logic analyzer or oscilloscope to capture waveforms, and check the device's status registers for error flags. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • Yes, follow proper PCB layout and shielding guidelines to minimize EMI. Ensure that the device is properly decoupled, and use EMI filters or shielding if necessary. Consult the datasheet and application notes for more information.

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MIC23303YML-TR Overview

Use the download button to access the MIC23303YML-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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