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MIC23451-AAAYFL-T5 - Microchip

Description: Microchip, MIC23451-AAAYFL-T5 Step-Down Switching Regulator Triple 2A Adjustable, 1 → 3.3 V, 26-Pin QFN

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PCB Footprints
MIC23451-AAAYFL-T5 - Microchip PCB footprint - Other - Other - MIC23451-AAAYFL-T5-3
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MIC23451-AAAYFL-T5 - Microchip  - 3D model - Other - MIC23451-AAAYFL-T5-3
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MIC23451-AAAYFL-T5 Details

  • Manufacturer Part Number:

    MIC23451-AAAYFL-T5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    26

  • Manufacturer Package Code:

    VQFN-26

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO REQUIRE PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-XQCC-N26

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC26,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

MIC23451-AAAYFL-T5 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended for optimal thermal performance. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or use thermal simulation tools to ensure optimal performance.
  • Microchip provides a configuration tool or a software development kit (SDK) that helps engineers configure the MIC23451-AAAYFL-T5 for their specific application. It's essential to consult the user manual and application notes for guidance on configuring the device.
  • When designing a power supply with the MIC23451-AAAYFL-T5, critical components to consider include the input capacitor, output capacitor, inductor, and diode. The datasheet provides guidelines for selecting these components, but it's essential to consider the specific application requirements and consult with a power supply expert if needed.
  • To troubleshoot issues with the MIC23451-AAAYFL-T5, start by consulting the datasheet and application notes. Check the PCB layout, component selection, and configuration settings. Use oscilloscopes and thermal imaging tools to identify the root cause of the issue. If needed, contact Microchip's technical support or a qualified engineer for assistance.
  • The MIC23451-AAAYFL-T5 meets various reliability and quality standards, including AEC-Q100, IEC 60747, and ISO 9001. These standards ensure the device meets specific requirements for automotive, industrial, and consumer applications. Consult the datasheet and Microchip's quality documentation for more information.

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MIC23451-AAAYFL-T5 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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