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MIC23451-AAAYFL-TR - Microchip

Description: Switching Voltage Regulators Adj. Switching Buck Regulator IC

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MIC23451-AAAYFL-TR - Microchip - PCB symbol
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PCB Footprints
MIC23451-AAAYFL-TR - Microchip PCB footprint - Other - Other - 26 QFN 4X4
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3D Models
MIC23451-AAAYFL-TR - Microchip - 3D model - Other - 26 QFN 4X4
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MIC23451-AAAYFL-TR Details

  • Manufacturer Part Number:

    MIC23451-AAAYFL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    26

  • Manufacturer Package Code:

    VQFN-26

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-XQCC-N26

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC26,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

MIC23451-AAAYFL-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines. This includes using a heat sink, ensuring good airflow, and selecting components with high-temperature ratings. Additionally, consider using thermal interface materials to improve heat transfer.
  • The recommended input capacitor is a 10uF ceramic capacitor with X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X7R or X5R dielectric. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the device's output voltage, first, verify that the input voltage is within the recommended range. Check the output voltage using a multimeter and ensure that it is within the specified tolerance. If the issue persists, check the PCB layout for any signs of overheating or electrical noise. Consult the datasheet for more troubleshooting guidelines.
  • The recommended soldering profile for the MIC23451-AAAYFL-TR is a peak temperature of 260°C (500°F) with a dwell time of 10-30 seconds. Ensure that the soldering process is done in a controlled environment with minimal thermal shock to prevent damage to the device.

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MIC23451-AAAYFL-TR Overview

Use the download button to access the MIC23451-AAAYFL-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC23, or try a keyword search, such as Switching Regulator or Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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