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MIC2544-1YM-TR - Microchip

Description: Power Switch ICs - Power Distribution Programmable Current Limit Single High-Side Switch

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MIC2544-1YM-TR - Microchip - PCB symbol
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PCB Footprints
MIC2544-1YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 PIN SOIC-D
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MIC2544-1YM-TR - Microchip - 3D model - Small Outline Packages - 8 PIN SOIC-D
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MIC2544-1YM-TR Details

  • Manufacturer Part Number:

    MIC2544-1YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max (Isup):

    0.16 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.93 mm

MIC2544-1YM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2544-1YM-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal vias small and numerous can help to dissipate heat more efficiently.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure good thermal conductivity between the device and the PCB. Additionally, consider using a thermally conductive adhesive or thermal tape to improve heat transfer.
  • To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, and ensure that the MIC2544-1YM-TR is placed away from noise sources. Use shielding, filtering, and grounding techniques to minimize electromagnetic radiation. Additionally, consider using a metal can or shielded enclosure to contain EMI and RFI.
  • To ensure proper power sequencing and startup, follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure that the input voltage is stable and within the recommended range before applying power to the MIC2544-1YM-TR. Additionally, consider using a soft-start circuit to reduce inrush current and prevent voltage droop.
  • To ensure reliable operation, thermal derating is essential. Consider the maximum junction temperature (Tj) and the thermal resistance (RθJA) when calculating the maximum power dissipation. Derate the device's power rating based on the ambient temperature and the device's thermal performance to prevent overheating.

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MIC2544-1YM-TR Overview

Use the download button to access the MIC2544-1YM-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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