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MIC2549A-1YM-TR - Microchip

Description: Power Switch ICs - Power Distribution Programmable Current Limit High-Side Switch with Over-Temperature Latch

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MIC2549A-1YM-TR - Microchip - PCB symbol
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MIC2549A-1YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 SOIC (M)
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MIC2549A-1YM-TR - Microchip - 3D model - Small Outline Packages - 8 SOIC (M)
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MIC2549A-1YM-TR Details

  • Manufacturer Part Number:

    MIC2549A-1YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP8,.25

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max (Isup):

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

MIC2549A-1YM-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a common mode choke and a ferrite bead to filter out high-frequency noise.
  • The MIC2549A-1YM-TR has a thermal pad on the bottom of the package. Ensure that the thermal pad is connected to a solid ground plane on the PCB, and that the PCB is designed to dissipate heat efficiently. Additionally, consider using a heat sink or a thermal interface material to improve thermal management.
  • The recommended input capacitor value for MIC2549A-1YM-TR is 10uF to 22uF, with a voltage rating of at least 25V. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.
  • The MIC2549A-1YM-TR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly thermally managed and that the operating conditions are within the recommended specifications.
  • Start by checking the input voltage and current, and ensure that the device is properly powered. Check the output voltage and current, and ensure that the load is within the recommended specifications. Use an oscilloscope to check for noise and ripple on the input and output, and ensure that the device is properly decoupled. Consult the datasheet and application notes for more troubleshooting tips.

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MIC2549A-1YM-TR Overview

Use the download button to access the MIC2549A-1YM-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC25, or try a keyword search, such as Peripheral Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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