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MIC2860-2PYC6-TR - Microchip

Description: High Efficiency (No Switching Losses) • PWM Frequency as Low as 250 Hz • Input Voltage Range: 3.0V to 5.5V • Linear Driver Dropout of 52 mV at 30.2 mA • Matching Better than ±0.5% (Typical) • Current Accuracy Better than 1.0% (Typical) • Available in Thin SOT-23 and SC-70 Packages

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PCB Footprints
MIC2860-2PYC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-70 (C6)-1
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3D Models
MIC2860-2PYC6-TR - Microchip  - 3D model - SOT23 (6-Pin) - SC-70 (C6)-1
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MIC2860-2PYC6-TR Details

  • Manufacturer Part Number:

    MIC2860-2PYC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC2860-2PYC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2860-2PYC6-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to ensure optimal performance.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence outlined in the datasheet. Ensure that the input voltage is within the specified range, and that the device is properly configured using the EN and SYNC pins. Additionally, consult the datasheet for specific guidelines on power-up and configuration.
  • The recommended input and output capacitors for the MIC2860-2PYC6-TR are typically 10uF to 22uF X7R or X5R ceramic capacitors. However, the optimal capacitor values may vary depending on the specific application and operating conditions. Consult the datasheet and application notes for more information.
  • To troubleshoot issues with the MIC2860-2PYC6-TR, start by verifying the power supply and input voltage. Check for proper PCB layout, decoupling, and thermal management. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. Consult the datasheet, application notes, and Microchip's technical support resources for guidance.
  • The MIC2860-2PYC6-TR has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Consult the datasheet and thermal management guidelines to ensure the device operates within its specified temperature range.

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MIC2860-2PYC6-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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