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MIC2981/82YWM-TR - Microchip

Description: Latches Hi-Voltage, Hi-Current Source Driver Array

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MIC2981/82YWM-TR Details

  • Manufacturer Part Number:

    MIC2981/82YWM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    18

  • Manufacturer Package Code:

    SOIC-18

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    3 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • JESD-609 Code:

    e3

  • Length:

    11.608 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP18,.40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.616 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    50 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    35 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    2 µs

  • Width:

    7.6 mm

MIC2981/82YWM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2981/82YWM-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal path short and direct can help to reduce thermal resistance.
  • To ensure reliable operation over the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure good thermal conductivity between the device and the PCB. Additionally, consider using a thermally conductive adhesive or thermal tape to improve heat transfer.
  • For EMI and RFI suppression, it is essential to use a good PCB layout, keep the power supply lines short and direct, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Additionally, consider using shielding or a metal enclosure to reduce electromagnetic radiation.
  • When selecting input and output capacitors, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a voltage rating that exceeds the maximum input voltage, and select capacitors with low ESR to minimize energy losses. Additionally, consider using X7R or X5R dielectric capacitors for their stability over temperature.
  • When thermal derating, consider the maximum ambient temperature, the device's power dissipation, and the thermal resistance of the package. Derate the device's power dissipation according to the ambient temperature, and ensure that the device's junction temperature does not exceed the maximum rated temperature.

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MIC2981/82YWM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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