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MIC3232YMM - Microchip

Description: LED Lighting Drivers 400kHz Fixed Frequency Boost Driver Controller for High Power LEDs

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MIC3232YMM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-MSOP MM-1
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3D Models
MIC3232YMM - Microchip  - 3D model - Small Outline Packages - 10-MSOP MM-1
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MIC3232YMM Details

  • Manufacturer Part Number:

    MIC3232YMM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    LEAD FREE, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN PEAK CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    440 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MIC3232YMM Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC3232YMM near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have a solid ground plane to help dissipate heat.
  • To ensure proper decoupling, place a 1-10uF ceramic capacitor between the VIN pin and the GND pin, as close to the MIC3232YMM as possible. This helps to filter out high-frequency noise and ensure stable operation.
  • A 10-22uF ceramic capacitor with an X5R or X7R dielectric is recommended for the input capacitor. This value provides a good balance between filtering and stability.
  • The EN pin should be tied to a logic-level signal that is only asserted after the input voltage has reached a stable level. During power-down, the EN pin should be de-asserted before the input voltage drops below the UVLO threshold.
  • The maximum allowed voltage drop across the output capacitor is 100mV. Exceeding this value may cause the MIC3232YMM to oscillate or become unstable.

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MIC3232YMM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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