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MIC33050-4YHL-TR - Microchip

Description: Buck Switching Regulator IC Positive Fixed 1.2V 1 Output 600mA 12-VFDFN Exposed Pad, 12-MLF®

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PCB Footprints
MIC33050-4YHL-TR - Microchip PCB footprint - Other - Other - MIC33050-4YHL-TR-4
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3D Models
MIC33050-4YHL-TR - Microchip  - 3D model - Other - MIC33050-4YHL-TR-4
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MIC33050-4YHL-TR Details

  • Manufacturer Part Number:

    MIC33050-4YHL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    12

  • Manufacturer Package Code:

    VDFN-12

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    PFM TECHNIQUE IS ALSO POSSIBLE; ALSO OPERATES IN ADJUSTABLE MODE FROM 0.72 TO 3.3 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-XDSO-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Nom:

    1.2 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MIC33050-4YHL-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC33050-4YHL-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note or a reference design from Microchip can provide more specific guidance.
  • To ensure a stable and accurate output voltage, it's essential to follow the recommended capacitor selection and placement guidelines in the datasheet. Additionally, the input voltage should be well-regulated, and the output should be decoupled with a suitable capacitor. A good understanding of the load's current requirements and the regulator's current limit is also crucial.
  • Exceeding the maximum junction temperature (TJ) of 125°C can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain its performance and longevity.
  • To protect the MIC33050-4YHL-TR from input voltage surges or spikes, consider adding a transient voltage suppressor (TVS) or a voltage clamp diode at the input. Additionally, a good quality input capacitor can help filter out noise and reduce the risk of damage from voltage spikes.
  • The recommended input capacitor type is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric capacitor. The value depends on the specific application, but a typical value is 10uF to 22uF. The datasheet provides more information on input capacitor selection.

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MIC33050-4YHL-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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