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MIC33153-YHJ-TR - Microchip

Description: 4 MHz 1.2A Internal Inductor PWM Buck Regulator with HyperLight Load® and Power Good, 14-pin 3.0 x 3.5 x 1.1 mm TDFN

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MIC33153-YHJ-TR - Microchip - PCB symbol
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PCB Footprints
MIC33153-YHJ-TR - Microchip PCB footprint - Other - Other - MIC33153-YHJ-TR-6
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MIC33153-YHJ-TR - Microchip - 3D model - Other - MIC33153-YHJ-TR-6
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MIC33153-YHJ-TR Details

  • Manufacturer Part Number:

    MIC33153-YHJ-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, SOLCC14,.12,20

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-06-28

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-N14

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.2 A

  • Output Voltage-Max:

    3.6 V

  • Output Voltage-Min:

    0.7 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1.15 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MIC33153-YHJ-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC33153YHJ-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or use thermal simulation tools to optimize the design.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence outlined in the datasheet. Ensure that the input voltage is within the specified range, and that the device is properly configured using the EN and SYNC pins. Additionally, consult the datasheet for specific guidelines on power-up and configuration.
  • When designing a power supply using the MIC33153YHJ-TR, critical components to consider include the input and output capacitors, inductors, and resistors. Ensure that these components meet the recommended specifications outlined in the datasheet, and that they are properly selected to ensure stable operation and optimal performance.
  • To troubleshoot issues with the MIC33153YHJ-TR, start by consulting the datasheet and application notes for guidance on troubleshooting common issues. Use oscilloscopes and other diagnostic tools to identify the root cause of the problem. Check for proper power-up and configuration, and ensure that the device is operating within the recommended specifications.
  • The MIC33153YHJ-TR has a maximum junction temperature of 150°C. To ensure reliable operation in high-temperature environments, ensure good airflow around the device, use a heat sink or thermal pad, and follow the recommended PCB layout guidelines. Consult the datasheet for thermal specifications and guidelines for high-temperature operation.

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MIC33153-YHJ-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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