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MIC37303YME-TR - Microchip

Description: LDO Voltage Regulators 3A, Low Voltage uCap LDO Regulator

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MIC37303YME-TR - Microchip - PCB symbol
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PCB Footprints
MIC37303YME-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-8
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MIC37303YME-TR - Microchip - 3D model - Small Outline Packages - SSOP-8
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MIC37303YME-TR Details

  • Manufacturer Part Number:

    MIC37303YME-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.3 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.93 mm

  • Load Regulation-Max(%):

    1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Voltage1-Max:

    5.5 V

  • Output Voltage1-Min:

    1.24 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.68 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.94 mm

MIC37303YME-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC37303YME-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note or a reference design from Microchip can provide more specific guidance.
  • To ensure a stable and accurate output voltage, it's essential to follow proper layout and decoupling guidelines, use a stable input voltage, and ensure the output capacitor is of high quality and suitable for the application. Additionally, the MIC37303YME-TR has a soft-start feature that can help reduce output voltage overshoot during startup.
  • While the datasheet specifies a maximum input voltage of 26V, it's essential to consider the maximum voltage rating of the specific package and the application's requirements. In general, it's recommended to operate the device within the specified input voltage range to ensure reliable operation and prevent damage.
  • The MIC37303YME-TR has built-in overcurrent protection (OCP) and thermal shutdown (TSD) features. However, it's still essential to implement external protection mechanisms, such as fuses or PTC resistors, to prevent damage from excessive current or heat. A good thermal design and proper airflow can also help prevent overheating.
  • While the MIC37303YME-TR is a high-performance device, it's essential to evaluate its suitability for high-reliability or automotive applications. Microchip provides specific devices and documentation for these applications, such as the AEC-Q100 qualified MIC37303YME-TR, which meets the requirements for automotive applications.

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MIC37303YME-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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