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MIC38300HYHL-TR - Microchip

Description: LDO Voltage Regulators 3A HELDO, -High Efficiency Low Dropout Regulator

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MIC38300HYHL-TR - Microchip PCB footprint - Other - Other - MIC38300HYHL-TR-2
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MIC38300HYHL-TR - Microchip  - 3D model - Other - MIC38300HYHL-TR-2
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MIC38300HYHL-TR Details

  • Manufacturer Part Number:

    MIC38300HYHL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HVQCCN, LCC28(UNSPEC)

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE FREQUENCY MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XQCC-N28

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium (Ni/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

MIC38300HYHL-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a soft-start circuit to limit the inrush current during start-up. For shutdown, ensure a controlled ramp-down of the output voltage to prevent voltage spikes.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure the filter components are placed close to the MIC38300HYHL-TR.
  • Use a low-ESR output capacitor and a high-frequency ceramic capacitor in parallel to reduce output voltage ripple and noise. Optimize the capacitor values and placement for minimum parasitic inductance.
  • Ensure good airflow around the device, and use a heat sink or thermal interface material to improve heat dissipation. Keep the device away from other heat sources and ensure a low thermal resistance path to the ambient air.

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MIC38300HYHL-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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