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MIC4120YME-TR - Microchip

Description: Gate Drivers Improved 6A High Speed, Hi-Current Single MOSFET Driver

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MIC4120YME-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 -Pin Exposed pad soic (Me)
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MIC4120YME-TR - Microchip  - 3D model - Small Outline Packages - 8 -Pin Exposed pad soic (Me)
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MIC4120YME-TR Details

  • Manufacturer Part Number:

    MIC4120YME-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.93 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.135 µs

  • Turn-on Time:

    0.135 µs

  • Width:

    3.94 mm

MIC4120YME-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad to connect the device to the PCB.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature and adjust the design accordingly.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potential device failure. It's essential to design for thermal margins and monitor temperature during operation.
  • Follow proper ESD handling procedures during assembly and storage. Use ESD-protective packaging, wrist straps, and mats. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays.
  • Follow the recommended soldering profile, and use a soldering iron with a temperature-controlled tip. For rework, use a hot air station or a rework station with a temperature-controlled nozzle.

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MIC4120YME-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Buffer/Inverter Based MOSFET Driver