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MIC4125YME-TR - Microchip

Description: Low-Side Gate Driver IC Inverting, Non-Inverting 8-SOIC-EP

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MIC4125YME-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Small Outline Integrated Circuit Package (EQA
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MIC4125YME-TR Details

  • Manufacturer Part Number:

    MIC4125YME-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.16 µs

  • Turn-on Time:

    0.16 µs

  • Width:

    3.9 mm

MIC4125YME-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the output current at high temperatures to prevent overheating.
  • Exceeding the maximum junction temperature (TJ) can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's essential to ensure that the device operates within the recommended temperature range to prevent overheating.
  • Use a TVS (transient voltage suppressor) or a zener diode to clamp voltage transients. Ensure that the input and output capacitors are rated for the maximum voltage and current. Also, consider adding a fuse or a PTC (positive temperature coefficient) thermistor to protect against overcurrent conditions.
  • A low-ESR (equivalent series resistance) ceramic capacitor with a value of 10 μF to 22 μF is recommended. This helps to filter out noise and ripple, ensuring stable operation.

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MIC4125YME-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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