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MIC4452YM-TR - Microchip

Description: Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver

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MIC4452YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-pin SOIC (M)
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MIC4452YM-TR - Microchip  - 3D model - Small Outline Packages - 8-pin SOIC (M)
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MIC4452YM-TR Details

  • Manufacturer Part Number:

    MIC4452YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Peak Current Limit-Nom:

    12 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.115 µs

  • Turn-on Time:

    0.14 µs

  • Width:

    3.94 mm

MIC4452YM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC4452YM-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have a solid ground plane to help dissipate heat.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection for the MIC4452YM-TR, follow proper ESD handling procedures during device handling and assembly, and consider using ESD protection devices or circuits in the system design.
  • Key considerations for PCB assembly and rework include following proper soldering and desoldering techniques, using appropriate soldering temperatures and times, and ensuring that the device is properly cleaned and dried after rework.

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MIC4452YM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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